please contact us for mass production schedule. specifcations in this bulletin are subject to change without notice. nippon chemi-con corporation 1755 1 hxc series high reliability and high voltage are realized by hybrid electrolyte endurance with ripple current : 4,000 hours at 125 rated voltage range : 16 to 35v dc , capacitance range : 150 to 470f for high temperature and high reliability applications. (automotive equipment, base station equipment, etc.) halogen free. specifications items characteristics category temperature range -55 to +125 rated voltage range 16 to 35v dc capacitance tolerance 20% m (at 20 , 120hz) leakage current i=0.01cv where, i : max. leakage current (a), c : nominal capacitance (f), v : rated voltage (v) (at 20 after 2 minutes) dissipation factor (tan ) rated voltage (v dc ) 16v 25v 35v (at 20 , 120hz) tan (max.) 0.16 0.14 0.12 low temperature characteristics (max. impedance ratio) z(-25 ) / z(+20 ) Q 1.5 z(-55 ) / z(+20 ) Q 2.0 (at 100khz) endurance the following specifcations shall be satisfed when the capacitors are restored to 20 after subjected to dc voltage with the rated ripple current is applied (the peak voltage shall not exceed the rated voltage) for 4,000 hours at 125 . capacitance change Q 30 of the initial value d.f. (tan ) Q 200 of the initial specifed value esr Q 200 of the initial specifed value leakage current Q the initial specifed value shelf life the following specifcations shall be satisfed when the capacitors are restored to 20 after exposing them for 1,000 hours at 125 without voltage applied. before the measurement, the capacitor shall be preconditioned by applying voltage according to item 4.1 of jis c 5101-4. capacitance change Q 30 of the initial value d.f. (tan ) Q 200 of the initial specifed value esr Q 200 of the initial specifed value leakage current Q the initial specifed value bias humidity test the following specifcations shall be satisfed when the capacitors are restored to 20 after subjecting them to the dc rated voltage at 85 , 85% rh for 2,000 hours. appearance no signifcant damage capacitance change Q 30 of the initial value d.f. (tan ) Q 200 of the initial specifed value esr Q 200 of the initial specifed value leakage current Q the initial specifed value part numbering system 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 h h x c a r a m g supplement code size code capacitance tolerance code capacitance code (ex. 150f:151, 470f:471) taping code terminal code voltage code (ex. 16v:160, 35v:350 ) series code category size code d l a b c w p ha0 8 10.0 8.3 8.3 9.0 0.7 to 1.1 3.1 ja0 10 10.0 10.3 10.3 11.0 0.7 to 1.1 4.5 marking ex) 35v150f 26a 150 v hc ? rated voltage symbol rated voltage (v dc ) symbol 16 c 25 e 35 v vent for ja0 dimensions mm terminal code : a d0.5 0.3max. l0.5 b0.2 c0.2 p ? a0.2 w engineering bulletin introductory no.849c/may.2015 conductive polymer hybrid aluminum electrolytic capacitors
please contact us for mass production schedule. specifcations in this bulletin are subject to change without notice. nippon chemi-con corporation 1755 2 hxc series standard ratings wv (v dc ) cap (f) size code esr (m max/20 , 100khz) rated ripple current (marms/125 , 100khz) part no. 16 270 ha0 22 1,700 hhxc160ara271mha0g 470 ja0 18 2,100 hhxc160ara471mja0g 25 220 ha0 27 1,600 hhxc250ara221mha0g 330 ja0 20 2,000 hhxc250ara331mja0g 35 150 ha0 27 1,600 HHXC350ARA151MHA0G 270 ja0 20 2,000 hhxc350ara271mja0g recommended reflow soldering conditions the following conditions are recommended for air convection and infrared refow soldering on the smd products on to a glass epoxy circuit boards by cream solder. the dimensions of the glass epoxy boards with resist are 90500.8mm. the temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals. refow should be performed twice or less. please ensure that the capacitor became cold enough to the room temperature (5 to 35 ) before the second refow. refow profle size code preheat time maintained above 217 time maintained above 230 peak temp. refow number ha0, ja0 150 to 180 120 sec. max. 50 sec. max. 40 sec. max. 260 max. 1-cycle only 245 max. 2-cycle allowed pma series npcap tm - standard ratings recommended solder land(based on the px series) [mm] reflow profile location of capacitor c a b b solder land on pc board 217 230 peak preheat peak temperature time (sec.) max. period of time over 230 temperature on the top of capacitor temperature of capacitor terminal and ( ) max. period of time over 217 recommended reflow soldering conditions nippon chemi-con corporation 1595 engineering bulletin conductive polymer aluminum solid capacitors no.824c / oct.2012 tentative 2 cap (f) rated ripple current -55 Q tx Q +85 * 1 +85 < tx Q +105 * 1 ( marms/100khz) part no. 16 20 25 apma160ara680mf40s 40 f40 apma160ara151mf60s 18 f60 apma160ara390mf40s 2,200 3,300 2,200 2,700 4,100 2,700 40 f40 apma200ara470mf40s 45 f40 apma200ara151mf60s 20 f60 apma160ara221mf60s 2,100 3,200 3,300 2,600 3,700 4,100 18 f60 apma250ara220mf40s 50 f40 apma250ara560mf60s 26 f60 apma250ara150mf40s 2,000 2,800 2,000 2,400 3,400 2,400 50 544 1,200 312 470 1,500 1,760 275 700 187 f40 68 150 39 47 150 220 22 56 15 wv (v dc ) size code leakage current (amax/after 2min.) esr (m max/ 2 0 , 100k to 300khz) speci?cations in this bulletin are subject to change without notice. please ask us for technical specifications before purchase and use. *1 tx: ambient temperature voltage range(v dc ) reflow number preheat time maintained above 230 peak temp. 16 to 25v 1-cycle only 150 to 180 120 sec.max. 50 sec.max. 250 max. 30 sec.max. 40 sec.max. 2-cycle allowed time maintained above 217 40 sec.max. size code a b c f40,f60 1.6 3.5 1.9 product specifications in this catalog are subject to change without notice.request our product specifications before purchase and/or use. please use our products based on the information contained in this catalog and product specifications. 1.0 1.4 1.9 2.3 3.1 4.5 4.0 6.0 6.0 re?o w s olderin g r e?o w the capacitors within recommended r e ?o w solder ing conditions . v e rify there is no temper ature stress to the capacitors because the f ollo w - ing diff erences might degrade capacitors electr ically and mechanically . p leas e consult us i f o t her r e?o w c ondit ions are emplo y ed. 1.location of components : t emper ature increases at the edge of pc board more t han t he c ent e r . 2 . p opulat ion o f pc board : t he l o w er t he component populat ion i s , t he more t emper a t ure r i s e s . 3 . mat e r ial o f pc board : a cer amic made board needs more heat t han a glass epo x y made board. t he heat inc reas e m a y cause damage t o t he c apac i t ors . 4 .thic kness o f p c board : a t hicker board needs more heat t han a t hin- ner board. t he heat inc reas e m a y damage t he capac i t ors . 5 .si z e o f p c boar d : a lar ger boar d needs m o r e heat t han a smaller board. t he heat inc reas e m a y damage t he capac i t ors . 6 .solder t hic k nes s if v e r y t hin cream solder past e i s t o be used f or s md t ypes , pleas e c onsult wit h u s . 7 . loc a t ion o f inf r ared r a y lamps : i r r e?o w as w ell a s hot plat e r e?o w heat s only on t he r e v ers e s ide o f t he p c board t o lessen heat s t res s t o t he c apacit ors . 8 . v apor phase s older ing (vp s) i s not u s ed. recommended soldering conditions alc hip tm mv a / mv e /mzr/ mzj/mza/mvy/mzf/mz e / mzk /mla /mlf/m le/ mlk / mv l / mvj/mvh /mhl/mhb/mhj/mhk/mkb/mv -bp/mvk-bp 217 230 peak preheat peak temp. time (sec.) max. period of time over 217 max. period of time over 230 temp ( ) d55, d60, d61, d73 e55, e60, e61, e73 f55, f60, f61, f73, f80, f90 h63 ha0 ja0 ke0, kg5 lh0, ln0 mh0, mn0 size code terminal code : a terminal code : g a b 2.6 3.0 3.5 4.5 4.2 4.4 5.7 6.9 7.9 c 1.6 1.6 1.6 1.6 2.2 2.2 2.5 2.5 2.5 a 3.1 4.5 3.4 4.7 4.7 b 4.2 4.4 6.3 7.8 8.8 c 3.5 3.5 9.3 9.6 9.6 recommended solder land on pc board c b a : solder land on pc board location of capacitor b preca utions for users r e w ork of soldering use a solder ing iron f or r e w o r k . do not e xceed an iron tip temper ature of 3 8 0 1 0 and a n e x p osu re t i m e o f 3 0 . 5 sec o n d s . m e c h a n ical str ess d o n o t use t h e capacitors f o r lif tin g t h e p c b o a r d a n d g i v e s t r e s s t o t he c ap a cit o r . a v o id b e n din g the p c b o a r d . t h i s m a y d a mage the c a pacitor s . cle a n ing a s s emb l y boar d i mme diate l y a fte r s olv e nt c lea n ing, r e m o v e res i d u a l s o l v e n t w i th an air kni f e f o r at least 1 0 min u t e s . i f t h e solv e nt i s i nsuf? c i e n t l y d r y , t he c a pac i - t ors m a y cor rod e . coati ng o n a s semb l y b o a r d 1 . b e f ore cur i n g c o a ting m ate r ial , rem o v e t he c l e ani ng sol v ent s from t he assem b l y b oar d . 2 . b e f ore con f o r mal coa ting, a c h lor ide f ree pre - c oat mater i a l i s r e com- m ende d to d e crease the s t res s on t he c a pac itor s . m o ldi n g wit h r e s i n i nte r n al c h emi cal r eac t i o n gradu ally p r odu c es g as i n t h e cap acitor ; t hen, increasing inter nal pressure . if the end seal of the capacitor is completel y c o v e r d b y r esi n t he g a s wil l b e una b l e t o esca p e c a usi n g a pot e n t i all y d ang ero us s i t u a t i on. t h e c h lor ine con t ain ed r e s i n w ill pen etr a t e into t h e e nd seal, r each the inside e lem e n t , a nd c a use d a mag e of t h e c apaci t o r . other s r e f er t o pre c a u t ion s a nd g uid e l i n e s . sol d e r i ng met h o d the c apacitor s o f a l chip-s e r i es h a v e n o cap a bilit y to w i t h sta n d s uch d i p or w a v e s o l d e r i n g as t o tal ly i m mer ses compo n e n ts in t o a s o lder b a t h . size code d55 to f90 h63 to ja0 ke0 to mn0 smd type vertical 63v (mvh) , 80v 4 to 50v 6.3 to 50v 63 to 450v voltage range ( v d c ) preheat 150 to 180 120sec. max. 90sec. max 60sec. max. 60sec. max. 30sec. max. 30sec. max. 20sec. max. 60sec. max. 40sec. max. 30sec. max. 20sec. max. 20sec. max. - 260 max. 250 max. 245 max. 240max. 240 max. 230max. time maintained above 217 peak temp. 2 times or less 2 times or less 2 times or less 2 times or less 2 times or less 2 times or less reflow number time maintained above 230 63 to 100, 400v 4 to 63v (except 63v for mvh) the f ollo wing conditions are recommended f or air con v ection and infr ared re?o w solder ing on the smd products onto a glass epo xy circuit boards b y cream solder . the dimensions of the glass epo xy boards with resist are 90 50 0.8mm f or d55 to kg5 case code smd capacitors and 180 90 0.8mm f or lh0 to mn0 case codes smd capacitors . the temper atures sho wn are the surf ace temper ature v alues on the top of the can and on the capacitor ter minals . re?o w should be perf or med twice or less . please ensure that the capacitor became cold enough to the room temper ature (5 to 35 ) bef ore the second re?o w . consult with us when perf or ming re?o w pro?le in ipc / jedec (j-std-020) recommended solder ing heat conditions (except f or conductiv e p olymer alumin um solid capacitors) re?o w s olderin g r e?o w the capacitors within recommended r e?o w solder ing conditions . v e rify there is no temper ature stress to the capacitors because the f ollo w - ing diff erences might degrade capacitors electr ically and mechanically . p leas e consult us i f o t her r e?o w c ondit ions are emplo y ed. 1.location of components : t emper ature increases at the edge of pc board more t han t he c ent e r . 2 . p opulat ion o f pc board : t he l o w er t he component populat ion i s , t he more t emper a t ure r i s e s . 3 . mat e r ial o f pc board : a cer amic made board needs more heat t han a glass epo x y made board. t he heat inc reas e m a y cause damage t o t he c apac i t ors . 4 .thic kness o f p c board : a t hicker board needs more heat t han a t hin- ner board. t he heat inc reas e m a y damage t he capac i t ors . 5 .si z e o f p c boar d : a lar ger boar d needs m o r e heat t han a smaller board. t he heat inc reas e m a y damage t he capac i t ors . 6 .solder t hic k nes s if v e r y t hin cream solder past e i s t o be used f or s md t ypes , pleas e c onsult wit h u s . 7 . loc a t ion o f inf r ared r a y lamps : i r r e?o w as w ell a s hot plat e r e?o w heat s only on t he r e v ers e s ide o f t he p c board t o lessen heat s t res s t o t he c apacit ors . 8 . please consult us about vapor phase soldering (vps). [mm] surface mount type recommended soldering heat conditions flow soldering2605 for 10+1 seconds hand soldering 38010 for 30.5 seconds radial lead and snap-in type 76 cat. no. e1001o aluminum electrolytic capacitors engineering bulletin introductory no.849c/may.2015 conductive polymer hybrid aluminum electrolytic capacitors
|
